Our Sales Manager, Lino Poosch, is currently at the SEMICON Taiwan. It's the premier event in Taiwan for microelectronics manufacturing. Meet him at booth #1318 (D-Tek) or booth #1132 (NAGASE).- f.l.t.r.: Dany Ho, Lino Poosch, Patrick Kuo -

Our sales team at EMPC in Warsaw. The 21st European Microelectronics and Packaging Conference & Exhibition bringing industry and academia together. Meet us!

Thomas Oppert, Vice President/Global Sales & Marketing, at the 1st Executive Forum on Laser Technologies “From New Technologies to Emerging Applications” The forum brought together a worldclass panel of manufacturers, integrators and users experts and allowed participants to get valuable insights into the status and future of the laser industry as well as provided unprecedented opportunities for meeting with industry leaders.

Last Friday we welcomed our 6 new trainees. In the course of the next 3 - 3.5 years, our trainees get trained in two professions (microtechnologist and mechatronics technicians). The future skilled workers will pass through an extensive as well as practice-oriented training program according to latest standards, experiencing various divisions, departments and getting prepared optimally for their future.

PacTech activ - the finisher at the company run B2RUN Berlin

Our Sales Manager Sebastian at the technology conference "elmug4futures"

We wish all of our muslim customers, partners and friends a HAPPY & BLESSED EID - SELAMAD HARI RAYA PUASA!

Keep on RUNNING!!! - Also in this year we took part at the Berliner Firmenlauf ...

Our sales managers Lino and Martin at the NordPac in Gothenburg, Sweden (18th – 20th June 2017). The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field.

Our colleague Sebastian at the CHEMNITZER SEMINAR »System Integration Technologies« (June13-14, 2017). The focus of the 27th Chemnitzer Seminar is to discuss topics like packaging technologies for MEMS and devices for medical applications.

Visit us at ECTC at our booth # 301! The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

Visit from the Netherlands! The trainees, Noach Ben Idder and Jelmer de Jong, came from the Friesland College Leeuwarden and made an internship for three weeks at PacTech. School exchanges show the young Europeans the common path to understanding.